Kinyang Corporation - Thermal Conductive Paste Sheet
Kinyosha Co., Ltd. has maximized its long-accumulated technology in rubber compounding and filler dispersion to develop a non-silicone-based material.
■Non-silicone material There are no concerns about electrical contact failures or glass fogging caused by siloxane. ■No curing process required Since the curing reaction is already complete, it can be immediately passed to the next process after implementation, allowing for a reduction in man-hours. ■Surface conformability With excellent flexibility, it conforms to deep irregularities and complex shapes, filling gaps between the housing or heat sink and the heat source, thereby improving heat dissipation performance. ■Reduced reaction force There is significant stress relief after implementation and assembly, greatly reducing stress on the housing and circuit board components. ■Low bleed It significantly reduces oil bleed, thereby lowering the risk of contamination.
